| Transfer Engineering
and Manufacturing, Inc. (TEAM) Press Releases |
August 15, 2007
full release |
Transfer Engineering Devices Aboard Historic Phoenix Mars Mission - Partners with JPL on Key Soil Analysis Tool as Mission Searches for Water on Mars
Supporting the first mission to the polar regions of Mars, Transfer Engineering's innovative vacuum technology is aboard NASA's Phoenix spacecraft, which launched August 4 from Cape Canaveral Air Force Station in Florida. The Phoenix spacecraft includes a Microscopy, Electrochemistry, and Conductivity Analyzer (MECA) provided by Jet Propulsion Laboratory (JPL). JPL, a leader in the robotic exploration of the solar system, designed the MECA instrument and integrated Transfer Engineering's Sample Wheel & Translation Stage into the instrument, which is used to characterize the soil of Mars much like a gardener would test the soil in his or her yard.
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May 7, 2007
full release |
Transfer Engineering Announces the Bridge Offset Tool (BOT), a Cost-Effective, Loadlock and Transfer System for Bridging Process Modules.
The Transfer Engineering Bridge Offset Tool can receive a 200mm wafer at one transfer plane and transfer it into a 300mm process module at a different transfer plane. The BOT can also be used as a single wafer process tool.
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April 20, 2005
full release |
New CAROUSEL 200TM Cassette-Based, Small Footprint, Wafer Transfer and Loadlock System Offers Cost-Effective Alternative to Typical Robot.
Dual, independently controlled drives increase throughput on compact, SEMI-MESC-compatible, cassette-based loadlock system.
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January 1, 2005
full release |
Transfer Engineering Moves to Expanded Facilities.
The new building fills need for expanded engineering and assembly areas while adding a product demonstration center and enlarged cleanroom area.
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August 27, 2003
full release |
Transfer Engineering Expands its line of Small Footprint Wafer Transfer and Loadlock Systems with the TEAM-MateTM Cassette 300.
Compact, SEMI MESC-compatible, cassette-based loadlock system performs wafer transport motions similar to a costly cluster-tool robot.
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November 21, 2001
full release |
Transfer Engineering Offers New Small Footprint Wafer Transfer and Loadlock System.
Compact, SEMI MESC-compatible, loadlock system performs wafer transport motions similar to a costly cluster-tool robot.
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August 25, 2000
full release |
Transfer Engineering and Manufacturing, Inc. acquires Vacuum Products Group from Surface/Interface.
Company develops quality, unique, alternatives to meet specific customer needs while maintaining standard HV and UHV components, loadlocks and sample transfer systems.
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