Transfer Engineering
and Manufacturing, Inc. (TEAM) Press Releases
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January 1, 2005
The new building fills need for expanded engineering and assembly areas while adding a product demonstration center and enlarged cleanroom area.
The new building fills need for expanded engineering and assembly areas.
Fremont, Calif., January 1, 2005—Transfer Engineering and Manufacturing, Inc. (TEAM) announces a relocation to a facility with more than double the office and assembly space from their previous location. The new modern facility accommodates the need for greater engineering capability and larger assembly and test areas to meet the increase in production of wafer/substrate transfer and positioning systems.
Transfer Engineering provides standard along with unique, quality alternative HV and UHV components, loadlocks and sample transfer systems to OEM and End User customers in surface science, semiconductor, media, sputter deposition and R&D markets. Product lines include magnetically-coupled transporters, sample transfer and loadlock systems, heating stages, motion and placement systems and custom systems to meet specific customer requirements. The new corporate address is:
Transfer engineering and Manufacturing, Inc.
47697 Westinghouse Drive, Suite 100
Fremont, CA 94539-7401
Telephone: (510) 651-3000
FAX: (510) 651-3090
E-mail: team@transferengineering.com
Transfer Engineering and Manufacturing, Inc (TEAM), Fremont, California provides innovative products for OEM, Production Facility and R&D/University Lab customers in the Surface Science, Semiconductor, Media, Sputter Deposition and R&D markets. TEAMs core expertise is in the handling, transporting, positioning and manipulation of samples, semiconductor wafers, substrates, flat panels and other materials with precision and reliability in UHV, HV, and other challenging controlled environments. The product line includes MESC compatible wafer transport systems.
Contact: Judy Ackeret, (510) 651-3000, e-mail jackeret@transferengineering.com.
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