Transfer Engineering
and Manufacturing, Inc. (TEAM) Press Releases
back to Press Release page
May 7, 2007
Transfer Engineering Announces the Bridge Offset Tool (BOT), a Cost-Effective, Loadlock and Transfer System for Bridging Process Modules
The Transfer Engineering Bridge Offset Tool can receive a 200mm wafer at one transfer plane and transfer it into a 300mm process module at a different transfer plane. The BOT can also be used as a single wafer process tool.
Fremont, Calif., May 7, 2007—Whether converting to a larger wafer size or purchasing new equipment, transfer plane variations from one module to another can require a considerable engineering effort to accommodate. The Bridge Offset Tool can bridge the gap between two systems by receiving a wafer at one module's transfer plane, raise or lower it to a second transfer plane, move it horizontally and place it on an end effector to deliver it into a second module. The Bridge Offset Tool can also be used to deliver and retrieve single wafers. A manual door above the delivery end-effector and system controls allow for single wafer operation.
The BOT can be operated through an HMI (human-machine interface) or using RS232 communications from a central host computer. The BOT is supported by a clean room compatible epoxy powder coated frame and leveling castors.
The Bridge Offset Tool from Transfer Engineering & Manufacturing can be customized to meet a variety of requirements. This includes an upgrade that will add vertical lift to the delivery
end effector.
Transfer Engineering and Manufacturing, Inc (TEAM), Fremont, California provides innovative products for OEM, Production Facility and R&D/University Lab customers in the Surface Science, Semiconductor, Media, Sputter Deposition and R&D markets. TEAM's core expertise is in the handling, transporting, positioning and manipulation of samples, semiconductor wafers, substrates, flat panels and other materials with precision and reliability in UHV, HV, and other challenging controlled environments. The product line includes MESC compatible wafer transport systems.
Contact: Judy Ackeret, (510) 651-3000, e-mail jackeret@transferengineering.com.
|
|
