Transfer Engineering
and Manufacturing, Inc. (TEAM) Press Releases
back to Press Release page
April 20, 2005
New CAROUSEL 200TM Cassette-Based, Small Footprint, Wafer Transfer and Loadlock System Offers Cost-Effective Alternative to Typical Robot
Dual, independently controlled drives increase throughput on compact, SEMI-MESC-compatible, cassette-based loadlock system
Fremont, Calif., April 20, 2005 - Transfer Engineering and Manufacturing (TEAM) announces the CAROUSEL 200 TM, a compact, high vacuum compatible, cost-effective, cassette-based loadlock system designed to deliver wafers or other flat substrates from a SEMI standard or custom cassette into a process module.
The magnetically-coupled dual linear drive mechanisms, elevator system as well as the unique rotating carousel are powered by external motors allowing substrates to be repeatedly loaded and removed without breaking vacuum. The rotating carousel platform exchanges wafers with independently controlled dual linear drives—one drive can be removing a wafer from the cassette while the other drive is delivering a wafer to the process module. Incorporating the drives into the chamber wall significantly reduces the CAROUSEL footprint over standard robotic systems. The CAROUSEL 200 is capable of handling wafers, reticles, masks or substrates up to 200mm and can be operated as a stand-alone system or will communicate via RS/232. It can be configured for SMIF operation and/or with a z-axis process chamber end effector.
The CAROUSEL requires little or no engineering to integrate with a process module and the valve interface can be easily modified to mate with a wide variety of vacuum systems. This system is ideal for many applications involving substrate delivery to modules including process development, cost effective low-volume production, or as a manufacturing tool.
Transfer Engineering and Manufacturing, Inc (TEAM), Fremont, California provides innovative products for OEM, Production Facility and R&D/University Lab customers in the Surface Science, Semiconductor, Media, Sputter Deposition and R&D markets. TEAMs core expertise is in the handling, transporting, positioning and manipulation of samples, semiconductor wafers, substrates, flat panels and other materials with precision and reliability in UHV, HV, and other challenging controlled environments. The product line includes MESC compatible wafer transport systems.
Contact: Judy Ackeret, (510) 651-3000, e-mail jackeret@transferengineering.com.
|
|
