Transfer Engineering and Manufacturing, Inc. (TEAM)
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August 27, 2003 Transfer Engineering Expands its line of Small Footprint Wafer Transfer and Loadlock Systems with the TEAM-MateTM Cassette 300 Compact, SEMI MESC-compatible, cassette-based loadlock system performs wafer transport motions similar to a costly cluster-tool robot. Fremont, Calif., August 27, 2003 - Fremont, Calif., Transfer Engineering and Manufacturing (TEAM) announces the TEAM-Mate TM Cassette 300, a compact, high vacuum compatible, cost-effective, cassette-based loadlock system designed to load wafers or other flat substrates from a cassette into SEMI-standard or custom process modules. Exterior motors power the magnetically-coupled elevator system as well as the unique linear guide mechanism allowing substrates to be repeatedly loaded and removed without breaking vacuum. The linear guide mechanism is incorporated into the chamber wall which significantly reduces the overall footprint relative to standard robotic systems. The TEAM-Mate Cassette 300 is capable of handling wafers, masks or substrates up to 300mm and can be operated as a stand-alone system or will communicate via RS/232. This small footprint system can mimic the motions of a complex and costly robot but is more convenient to use, significantly less costly and requires little or no engineering to integrate with a process module. TEAM-Mate's valve interface can be easily modified to mate with a wide variety of vacuum systems. This system is ideal for many applications involving substrate delivery to modules including process development, cost effective low-volume production, or as a manufacturing tool. Transfer Engineering and Manufacturing, Inc (TEAM), Fremont, California provides innovative products for OEM, Production Facility and R&D/University Lab customers in the Surface Science, Semiconductor, Media, Sputter Deposition and R&D markets. TEAMs core expertise is in the handling, transporting, positioning and manipulation of samples, semiconductor wafers, substrates, flat panels and other materials with precision and reliability in UHV, HV, and other challenging controlled environments. The product line includes MESC compatible wafer transport systems. Contact: Judy Ackeret, (510) 651-3000, e-mail jackeret@transferengineering.com. |
