Transfer Engineering
and Manufacturing, Inc. (TEAM) Press Releases
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November 21, 2001
Transfer Engineering Offers New Small Footprint Wafer Transfer and Loadlock System
Compact, SEMI MESC-compatible, loadlock system performs wafer transport motions similar to a costly cluster-tool robot.
Fremont, Calif., November 21, 2001 - Fremont, Calif., Transfer Engineering and Manufacturing (TEAM) announces the TEAM-Mate-200 TM, a compact, high vacuum compatible, single-substrate loadlock system designed to load wafers or other flat substrates into a SEMI MESC-standard or custom process module.
The TEAM-Mate was designed with care in selection of interfacing materials and this along with an integrated magnetically-coupled transfer device with moving parts located well below transfer height minimizes generation of particulates. The magnet-transfer is incorporated into the chamber wall significantly reducing the system's overall footprint from standard magnetically-coupled transfer systems.
This system is ideal for several applications including sample delivery to modules for process development, for cost effective low-volume production or as a manufacturing tool.
TEAM-Mate's valve interface can be easily modified to mate with a wide variety of vacuum systems.
Transfer Engineering and Manufacturing (TEAM), Fremont, California provides innovative products for OEM, Production Facility and R&D/University Lab customers in the Surface Science, Semiconductor, Media, Sputter Deposition and R&D markets. TEAMs core expertise is in the handling, transporting, positioning and manipulation of samples, semiconductor wafers, substrates, flat panels and other materials with precision and reliability in UHV, HV, and other challenging controlled environments. The product line includes MESC compatible wafer transport systems.
Contact: Judy Ackeret, (510) 651-3000, e-mail jackeret@transferengineering.com.
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